Text Box: Latest CMP News 8/29/06: Rohm & Haas invests in Nanophase to continue CMP work 9/12/06: Rohm & Haas Unveils New Pad Products For Advanced CMP Text Box: Upcoming Events 9/11 – 9/13/06: SEMICON Taiwan in Taipei, Taiwan 9/25 – 9/28/06: 2006 VMIC in Fremont, CA 10/12 – 10/13/06: 2006 ICPT in Foster City, CA
Text Box: CMP’s beginning at IBM… The earliest chemical-mechanical planarization work at IBM, where it was first secretly conceived as a crucial new manufacturing concept, used a crude mechanical spinning plate without a sophisticated pad or slurry dispense mechanism. Since centrifugal force drove off the slurry, two men in raincoats and face-shields sprayed fresh slurry onto the spinning plate using automobile pressure-hoses.